During the Smart Systems Integrated Solutions master's (Aalto University, University of South-Eastern Norway, and Budapest University of Technology and Economics) I worked hands-on in the cleanroom, designed MEMS devices in COMSOL and ANSYS, and characterized sensors from sub-nanometer surface roughness up to full radiometric calibration of a thermal camera.
IDEAS (Integrated Detector Electronics AS) with USN · Jan to June 2026
M.Sc. thesis at IDEAS (Integrated Detector Electronics AS): radiometric characterization of an uncooled LWIR microbolometer camera and development of shutterless drift-compensation methods, together with the FastAPI and React platform used to stream, record, and calibrate it in real time.
Department of Microsystems, USN · Spring 2025
Replicated a published AlN MEMS microphone in COMSOL, validated the model against the paper, then re-engineered materials and geometry for a roughly threefold sensitivity gain tuned to wildlife acoustics.
Department of Microsystems, USN · Spring 2025
A complete microfabrication flow on silicon wafers in the USN cleanroom: oxidation, photolithography, dry and wet etching, and metallization, with metrology at every step.
Aalto University (Technology Entrepreneurship) · 2024
A solar-powered Raspberry Pi sensor node prototype for reducing elk-vehicle collisions: microphone arrays for direction-of-arrival estimation, an ML sound classifier, and environmental sensing, developed as a technology entrepreneurship project at Aalto.
IC and MEMS Design, BME · Autumn 2025
Coupled electrostatic-structural simulation of a MEMS accelerometer in ANSYS with hand-calculation checks at every step, exported as a reduced-order model and exercised in Twin Builder.
Heterogeneous Integration course, SSIs M.Sc. · Autumn 2024
3D COMSOL study of thermal-expansion mismatch stress in copper through-silicon-via arrays over a 25 to 400 C cycle, comparing an SiO2 liner against a compliant polymer liner.
Heterogeneous Integration course, SSIs M.Sc. · Autumn 2024
X-ray, optical, and SEM/EDS analysis of an ST piezoresistive pressure sensor, identifying its wafer-bonding technology and package construction.
Department of Microsystems, USN · 2024/2025
White-light interferometric metrology of RF MEMS switch structures with a Veeco Wyko NT9100, resolving sub-nanometer surface roughness.
Design and Analysis of MEMS (ELEC-E8715), Aalto University · 2024/2025
A series of individual design studies at Aalto: cantilever dynamics validated against analytics, a comb-drive accelerometer model, piezoelectric actuation comparisons, and a Butterworth-van Dyke fit of a GHz resonator.
Project Laboratory, BME Department of Electron Devices · Autumn 2025
A supervised literature study at BME on how wavelength-converting phosphors in white LEDs age, and how that aging is measured, synthesizing more than 20 studies into a technology comparison.